Gary Smith EDA Consulting in Electronic Design
Gary Smith EDA (GSEDA) is the leading provider of market intelligence and advisory services for the global Electronic Design Automation (EDA), Electronic System Level (ESL) design, and related technology markets.
Gary Smith EDA at DAC
ESL, CAE, CAD/CAM Wallcharts and What To See at DAC 2010 cards will be available at each event.
Gary Smith EDA at DAC
Anaheim Hilton, Pacific Ballroom C
Sunday June 13 7:30-8:30 pm
Come hear Gary & Mary’s annual update on the state of EDA.
3D Packaging Rises to the Level of Silicon
Advances in 3D package design are putting the "A" back in EDA. However, miscommunication and design gaps at the silicon level still impact packaging performance.
Don’t Panic! SoC Costs "Will" Come Down
EDA Industry is in a state of panic right now. Don't worry, once we get the price of an SoC Design under $25M, we'll resume healthy revenue growth.
No refreshments will be served. No need to register.
Right next door to EDAC reception.
DAC Pavilion Panel
Gary Smith on EDA: Trends and What's Hot at DAC
DAC Pavilion Panel, Booth 694
Monday June 14 9:15-10:15 am
Gary Smith of Gary Smith EDA reviews EDA's hottest technology trends. How will the dramatic changes in EDA, the semiconductor market and the design community affect you? What are the hot 'must sees' at this year's conference? Find out here!
Watch the very funny video:
DAC Management Day: Session 2:
Trade-offs and choices for Emerging SOCs
Tuesday June 15 2:00-4:00 pm
Session Chair: Gary Smith – Gary Smith EDA, Santa Clara, CA
Today's emerging SOCs require multiple types of optimizations and the adoption of advanced solutions to meet stringent design requirements. Optimizing for volume production, low power, and shrinking sizes necessitates accurate trade-off analysis and technical/business decision-making by management. This session will feature senior managers of today's most complex nanometer chips
Vice President, Advanced Process Technology Development, CSR
Director of Technology, and Prabhu Krishnamurthy, Director of Design Tools and Methodology, LSI Logic
Business & Technology Programs, Intel
Director, Qualcomm, Inc.
Synopsys’ Conversation Central at DAC
DAC booth# 595
Wednesday June 16 12:30-1:00pm
Gary Smith interview by Rich Goldman, Synopsys
“Don’t Panic! (How SoC Costs Will Come Down)”
Be part of the discussion in person or remotely.
What To See at DAC 2010 List Free
What To See at DAC 2010 Research Viewpoint $500
ESL Wallchart 2010 Free
ESL Wallchart Research Viewpoint $500
CAE Wallchart Free
CAD-CAM Wallchart 2010 Free
CAE/ CAD-CAM Wallcharts Research Viewpoint $500
Gary Smith’s Sunday night presentation: Don’t Panic! SoC Costs "Will" Come Down $500
Mary Olsson’s Sunday night presentation: 3D Packaging Rises to the Level of Silicon $500
Tech OnlineBuild, Borrow, Buy: New Approaches to Addressing Software Complexity
CadenceThe Denali Party by Cadence
Cadence blogsCadence DAC 2013 and Denali Party Update
Cadence blogsPanel: 3D-IC Design Experts Tackle “Practical Issues” in 2.5D and 3D TSV Deployment
Cadence blogsElectronic System Level (ESL) Design Gets a Pragmatic Look at EDPS Workshop